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Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

Bibliographic Details
Main Author: Schon, Aline Ferreira
Publication Date: 2019
Other Authors: Reyes, Rodrigo Valenzuela, Spinelli, José Eduardo, Garcia, Amauri, Silva, Bismarck Luiz
Format: Article
Language: eng
Source: Repositório Institucional da UFRN
dARK ID: ark:/41046/001300000cnbj
Download full: https://repositorio.ufrn.br/handle/123456789/32176
Summary: In the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys (containing 85 to 97 wt% of Pb) given that lead (Pb) is considered an important environmental complaint and has devastating effects on the human body. The imposed conditions in the present experiment may lead to solutal and thermal stability of the melt throughout solid growth towards the liquid. It was found that Sn-rich cells may prevail for cooling rates higher than 1.0 K/s whereas only Sn-rich dendrites appear for specimens solidified at rates lower than 0.3 K/s. The growth of dendrites is delayed when compared to previous results in the literature. In the presence of convective flow originated either thermally or solutally, β-Sn dendrites were reported to grow for samples solidified at rates as high as 1.5 K/s (i.e., 5 times higher). It appears that convection currents induce instabilities to happen at the solidification front and the growth of dendrites is benefited over such conditions. Tensile tests were also performed for Sn-Sb samples having distinct cellular and dendritic dimensions. It was found that unstable plastic flow happened during all tensile tests. The formation of bands along a specimen gauge was recognized as being a manifestation of the Portevin – Le Chatelier (PLC) effect. A homogeneous deformation stage preceded the start of serrations of stresses in the samples of the investigated alloy. The amplitudes of the serrations were found to be lower in the samples having cells as compared to those associated with dendritic microstructures
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spelling Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rateSn-Sb alloySoldersSolidificationMicrostructureTensile behaviorIn the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys (containing 85 to 97 wt% of Pb) given that lead (Pb) is considered an important environmental complaint and has devastating effects on the human body. The imposed conditions in the present experiment may lead to solutal and thermal stability of the melt throughout solid growth towards the liquid. It was found that Sn-rich cells may prevail for cooling rates higher than 1.0 K/s whereas only Sn-rich dendrites appear for specimens solidified at rates lower than 0.3 K/s. The growth of dendrites is delayed when compared to previous results in the literature. In the presence of convective flow originated either thermally or solutally, β-Sn dendrites were reported to grow for samples solidified at rates as high as 1.5 K/s (i.e., 5 times higher). It appears that convection currents induce instabilities to happen at the solidification front and the growth of dendrites is benefited over such conditions. Tensile tests were also performed for Sn-Sb samples having distinct cellular and dendritic dimensions. It was found that unstable plastic flow happened during all tensile tests. The formation of bands along a specimen gauge was recognized as being a manifestation of the Portevin – Le Chatelier (PLC) effect. A homogeneous deformation stage preceded the start of serrations of stresses in the samples of the investigated alloy. The amplitudes of the serrations were found to be lower in the samples having cells as compared to those associated with dendritic microstructures2021-12Elsevier2021-04-12T20:40:33Z2019-11-15info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleapplication/pdfSCHON, Aline Ferreira; REYES, Rodrigo Valenzuela; SPINELLI, José Eduardo; GARCIA, Amauri; SILVA, Bismarck Luiz. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal Of Alloys And Compounds, [S.L.], v. 809, p. 151780-151780, nov. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838819330130?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jallcom.2019.1517800925-8388https://repositorio.ufrn.br/handle/123456789/3217610.1016/j.jallcom.2019.151780ark:/41046/001300000cnbjAttribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/info:eu-repo/semantics/openAccessSchon, Aline FerreiraReyes, Rodrigo ValenzuelaSpinelli, José EduardoGarcia, AmauriSilva, Bismarck Luizengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRN2024-03-19T04:02:29Zoai:repositorio.ufrn.br:123456789/32176Repositório InstitucionalPUBhttp://repositorio.ufrn.br/oai/repositorio@bczm.ufrn.bropendoar:2024-03-19T04:02:29Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false
dc.title.none.fl_str_mv Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
spellingShingle Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
Schon, Aline Ferreira
Sn-Sb alloy
Solders
Solidification
Microstructure
Tensile behavior
title_short Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_full Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_fullStr Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_full_unstemmed Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_sort Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
author Schon, Aline Ferreira
author_facet Schon, Aline Ferreira
Reyes, Rodrigo Valenzuela
Spinelli, José Eduardo
Garcia, Amauri
Silva, Bismarck Luiz
author_role author
author2 Reyes, Rodrigo Valenzuela
Spinelli, José Eduardo
Garcia, Amauri
Silva, Bismarck Luiz
author2_role author
author
author
author
dc.contributor.author.fl_str_mv Schon, Aline Ferreira
Reyes, Rodrigo Valenzuela
Spinelli, José Eduardo
Garcia, Amauri
Silva, Bismarck Luiz
dc.subject.por.fl_str_mv Sn-Sb alloy
Solders
Solidification
Microstructure
Tensile behavior
topic Sn-Sb alloy
Solders
Solidification
Microstructure
Tensile behavior
description In the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys (containing 85 to 97 wt% of Pb) given that lead (Pb) is considered an important environmental complaint and has devastating effects on the human body. The imposed conditions in the present experiment may lead to solutal and thermal stability of the melt throughout solid growth towards the liquid. It was found that Sn-rich cells may prevail for cooling rates higher than 1.0 K/s whereas only Sn-rich dendrites appear for specimens solidified at rates lower than 0.3 K/s. The growth of dendrites is delayed when compared to previous results in the literature. In the presence of convective flow originated either thermally or solutally, β-Sn dendrites were reported to grow for samples solidified at rates as high as 1.5 K/s (i.e., 5 times higher). It appears that convection currents induce instabilities to happen at the solidification front and the growth of dendrites is benefited over such conditions. Tensile tests were also performed for Sn-Sb samples having distinct cellular and dendritic dimensions. It was found that unstable plastic flow happened during all tensile tests. The formation of bands along a specimen gauge was recognized as being a manifestation of the Portevin – Le Chatelier (PLC) effect. A homogeneous deformation stage preceded the start of serrations of stresses in the samples of the investigated alloy. The amplitudes of the serrations were found to be lower in the samples having cells as compared to those associated with dendritic microstructures
publishDate 2019
dc.date.none.fl_str_mv 2019-11-15
2021-04-12T20:40:33Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv SCHON, Aline Ferreira; REYES, Rodrigo Valenzuela; SPINELLI, José Eduardo; GARCIA, Amauri; SILVA, Bismarck Luiz. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal Of Alloys And Compounds, [S.L.], v. 809, p. 151780-151780, nov. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838819330130?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jallcom.2019.151780
0925-8388
https://repositorio.ufrn.br/handle/123456789/32176
10.1016/j.jallcom.2019.151780
dc.identifier.dark.fl_str_mv ark:/41046/001300000cnbj
identifier_str_mv SCHON, Aline Ferreira; REYES, Rodrigo Valenzuela; SPINELLI, José Eduardo; GARCIA, Amauri; SILVA, Bismarck Luiz. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal Of Alloys And Compounds, [S.L.], v. 809, p. 151780-151780, nov. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838819330130?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jallcom.2019.151780
0925-8388
10.1016/j.jallcom.2019.151780
ark:/41046/001300000cnbj
url https://repositorio.ufrn.br/handle/123456789/32176
dc.language.iso.fl_str_mv eng
language eng
dc.rights.driver.fl_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
info:eu-repo/semantics/openAccess
rights_invalid_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
dc.source.none.fl_str_mv reponame:Repositório Institucional da UFRN
instname:Universidade Federal do Rio Grande do Norte (UFRN)
instacron:UFRN
instname_str Universidade Federal do Rio Grande do Norte (UFRN)
instacron_str UFRN
institution UFRN
reponame_str Repositório Institucional da UFRN
collection Repositório Institucional da UFRN
repository.name.fl_str_mv Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)
repository.mail.fl_str_mv repositorio@bczm.ufrn.br
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