A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Bibliographic Details
Main Author: Dias, Marcelino
Publication Date: 2018
Other Authors: Costa, Thiago Antônio, Silva, Bismarck Luiz, Spinelli, José Eduardo, Cheunga, Noé, Garcia, Amauri
Format: Article
Language: eng
Source: Repositório Institucional da UFRN
dARK ID: ark:/41046/001300001svf2
Download full: https://repositorio.ufrn.br/handle/123456789/32178
Summary: Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability
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spelling A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloysSolder alloysSn-Sb alloysMicrostructureTensile propertiesWettabilitySn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettabilityElsevier2021-04-12T20:47:48Z2021-04-12T20:47:48Z2018-02info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleapplication/pdfDIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.0290026-2714https://repositorio.ufrn.br/handle/123456789/3217810.1016/j.microrel.2017.12.029ark:/41046/001300001svf2Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/info:eu-repo/semantics/openAccessDias, MarcelinoCosta, Thiago AntônioSilva, Bismarck LuizSpinelli, José EduardoCheunga, NoéGarcia, Amauriengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRN2021-04-18T09:05:42Zoai:repositorio.ufrn.br:123456789/32178Repositório InstitucionalPUBhttp://repositorio.ufrn.br/oai/repositorio@bczm.ufrn.bropendoar:2021-04-18T09:05:42Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false
dc.title.none.fl_str_mv A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
spellingShingle A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
Dias, Marcelino
Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
title_short A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_full A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_fullStr A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_full_unstemmed A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_sort A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
author Dias, Marcelino
author_facet Dias, Marcelino
Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
author_role author
author2 Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
author2_role author
author
author
author
author
dc.contributor.author.fl_str_mv Dias, Marcelino
Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
dc.subject.por.fl_str_mv Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
topic Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
description Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability
publishDate 2018
dc.date.none.fl_str_mv 2018-02
2021-04-12T20:47:48Z
2021-04-12T20:47:48Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.029
0026-2714
https://repositorio.ufrn.br/handle/123456789/32178
10.1016/j.microrel.2017.12.029
dc.identifier.dark.fl_str_mv ark:/41046/001300001svf2
identifier_str_mv DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.029
0026-2714
10.1016/j.microrel.2017.12.029
ark:/41046/001300001svf2
url https://repositorio.ufrn.br/handle/123456789/32178
dc.language.iso.fl_str_mv eng
language eng
dc.rights.driver.fl_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
info:eu-repo/semantics/openAccess
rights_invalid_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
dc.source.none.fl_str_mv reponame:Repositório Institucional da UFRN
instname:Universidade Federal do Rio Grande do Norte (UFRN)
instacron:UFRN
instname_str Universidade Federal do Rio Grande do Norte (UFRN)
instacron_str UFRN
institution UFRN
reponame_str Repositório Institucional da UFRN
collection Repositório Institucional da UFRN
repository.name.fl_str_mv Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)
repository.mail.fl_str_mv repositorio@bczm.ufrn.br
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