Impact of die carrier on reliability of power LEDs

Detalhes bibliográficos
Autor(a) principal: Kyatam, Shusmitha
Data de Publicação: 2021
Outros Autores: Alves, Luis N., Maslovski, Stanislav, Mendes, Joana C.
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
Texto Completo: http://hdl.handle.net/10773/41155
Resumo: High power light emitting diodes (LEDs) suffer from heating effects that have a detrimental impact on the devices characteristics. The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as alumina, aluminium nitride, and silicon. Diamond has also been gaining momentum for demanding heat management applications. In order to evaluate the impact of the carrier material on the reliability of the devices, the junction temperature of Cree white XLamp XB-D LEDs was obtained with Ansys for various carriers and different LED current levels. The impact of the junction temperature on the LED’s lifetime, emission intensity, footprint, and wavelength stability was then evaluated for each carrier based on the datasheet of the devices. The results provide additional knowledge regarding the impact of the carrier on the performance of the LED.
id RCAP_dbbb7132cad6baebe982b1897da20152
oai_identifier_str oai:ria.ua.pt:10773/41155
network_acronym_str RCAP
network_name_str Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
repository_id_str https://opendoar.ac.uk/repository/7160
spelling Impact of die carrier on reliability of power LEDsLight-emitting diodesReliabilityDiamondPackagingHigh power light emitting diodes (LEDs) suffer from heating effects that have a detrimental impact on the devices characteristics. The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as alumina, aluminium nitride, and silicon. Diamond has also been gaining momentum for demanding heat management applications. In order to evaluate the impact of the carrier material on the reliability of the devices, the junction temperature of Cree white XLamp XB-D LEDs was obtained with Ansys for various carriers and different LED current levels. The impact of the junction temperature on the LED’s lifetime, emission intensity, footprint, and wavelength stability was then evaluated for each carrier based on the datasheet of the devices. The results provide additional knowledge regarding the impact of the carrier on the performance of the LED.IEEE2024-03-21T18:36:19Z2021-01-01T00:00:00Z2021info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleapplication/pdfhttp://hdl.handle.net/10773/41155eng10.1109/JEDS.2021.3115027Kyatam, ShusmithaAlves, Luis N.Maslovski, StanislavMendes, Joana C.info:eu-repo/semantics/openAccessreponame:Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)instname:FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologiainstacron:RCAAP2024-05-06T04:54:41Zoai:ria.ua.pt:10773/41155Portal AgregadorONGhttps://www.rcaap.pt/oai/openaireinfo@rcaap.ptopendoar:https://opendoar.ac.uk/repository/71602025-05-28T14:24:01.646967Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) - FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologiafalse
dc.title.none.fl_str_mv Impact of die carrier on reliability of power LEDs
title Impact of die carrier on reliability of power LEDs
spellingShingle Impact of die carrier on reliability of power LEDs
Kyatam, Shusmitha
Light-emitting diodes
Reliability
Diamond
Packaging
title_short Impact of die carrier on reliability of power LEDs
title_full Impact of die carrier on reliability of power LEDs
title_fullStr Impact of die carrier on reliability of power LEDs
title_full_unstemmed Impact of die carrier on reliability of power LEDs
title_sort Impact of die carrier on reliability of power LEDs
author Kyatam, Shusmitha
author_facet Kyatam, Shusmitha
Alves, Luis N.
Maslovski, Stanislav
Mendes, Joana C.
author_role author
author2 Alves, Luis N.
Maslovski, Stanislav
Mendes, Joana C.
author2_role author
author
author
dc.contributor.author.fl_str_mv Kyatam, Shusmitha
Alves, Luis N.
Maslovski, Stanislav
Mendes, Joana C.
dc.subject.por.fl_str_mv Light-emitting diodes
Reliability
Diamond
Packaging
topic Light-emitting diodes
Reliability
Diamond
Packaging
description High power light emitting diodes (LEDs) suffer from heating effects that have a detrimental impact on the devices characteristics. The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as alumina, aluminium nitride, and silicon. Diamond has also been gaining momentum for demanding heat management applications. In order to evaluate the impact of the carrier material on the reliability of the devices, the junction temperature of Cree white XLamp XB-D LEDs was obtained with Ansys for various carriers and different LED current levels. The impact of the junction temperature on the LED’s lifetime, emission intensity, footprint, and wavelength stability was then evaluated for each carrier based on the datasheet of the devices. The results provide additional knowledge regarding the impact of the carrier on the performance of the LED.
publishDate 2021
dc.date.none.fl_str_mv 2021-01-01T00:00:00Z
2021
2024-03-21T18:36:19Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://hdl.handle.net/10773/41155
url http://hdl.handle.net/10773/41155
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv 10.1109/JEDS.2021.3115027
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv IEEE
publisher.none.fl_str_mv IEEE
dc.source.none.fl_str_mv reponame:Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
instname:FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia
instacron:RCAAP
instname_str FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia
instacron_str RCAAP
institution RCAAP
reponame_str Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
collection Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
repository.name.fl_str_mv Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) - FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia
repository.mail.fl_str_mv info@rcaap.pt
_version_ 1833594561946976256

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