Rheologically assisted design of conductive adhesives for stencil printing on PCB

Bibliographic Details
Main Author: Silva, Ângelo D. M.
Publication Date: 2021
Other Authors: Silva, Mariana M., Figueiredo, Hugo, Delgado, Isabel, Lopes, Paulo E., Paiva, Maria C., Hilliou, L.
Format: Article
Language: eng
Source: Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
Download full: https://hdl.handle.net/1822/77279
Summary: Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB.
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spelling Rheologically assisted design of conductive adhesives for stencil printing on PCBSolder pasteElectrically conductive adhesivesCarbon nanotubesExfoliated graphiteStencil printingYield stressPrinted circuit boardsRheologyEngenharia e Tecnologia::Engenharia dos MateriaisScience & TechnologyDriven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB.This work was supported by the European Structural and Investment Funds in the FEDER component, through the Operational Competitiveness and Internationalization Programme (COMPETE 2020) [Project n degrees 39479; Funding Reference: POCI-01-0247-FEDER-39479]. Additional funding by the by Portuguese Foundation for Science and Technology is acknowledged (projects UIDB/05256/2020 and UIDP/05256/2020).MDPIUniversidade do MinhoSilva, Ângelo D. M.Silva, Mariana M.Figueiredo, HugoDelgado, IsabelLopes, Paulo E.Paiva, Maria C.Hilliou, L.2021-12-152021-12-15T00:00:00Zinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleapplication/pdfhttps://hdl.handle.net/1822/77279eng10.3390/ma14247734info:eu-repo/semantics/openAccessreponame:Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)instname:FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologiainstacron:RCAAP2024-05-11T04:12:43Zoai:repositorium.sdum.uminho.pt:1822/77279Portal AgregadorONGhttps://www.rcaap.pt/oai/openaireinfo@rcaap.ptopendoar:https://opendoar.ac.uk/repository/71602025-05-28T14:42:22.349918Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) - FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologiafalse
dc.title.none.fl_str_mv Rheologically assisted design of conductive adhesives for stencil printing on PCB
title Rheologically assisted design of conductive adhesives for stencil printing on PCB
spellingShingle Rheologically assisted design of conductive adhesives for stencil printing on PCB
Silva, Ângelo D. M.
Solder paste
Electrically conductive adhesives
Carbon nanotubes
Exfoliated graphite
Stencil printing
Yield stress
Printed circuit boards
Rheology
Engenharia e Tecnologia::Engenharia dos Materiais
Science & Technology
title_short Rheologically assisted design of conductive adhesives for stencil printing on PCB
title_full Rheologically assisted design of conductive adhesives for stencil printing on PCB
title_fullStr Rheologically assisted design of conductive adhesives for stencil printing on PCB
title_full_unstemmed Rheologically assisted design of conductive adhesives for stencil printing on PCB
title_sort Rheologically assisted design of conductive adhesives for stencil printing on PCB
author Silva, Ângelo D. M.
author_facet Silva, Ângelo D. M.
Silva, Mariana M.
Figueiredo, Hugo
Delgado, Isabel
Lopes, Paulo E.
Paiva, Maria C.
Hilliou, L.
author_role author
author2 Silva, Mariana M.
Figueiredo, Hugo
Delgado, Isabel
Lopes, Paulo E.
Paiva, Maria C.
Hilliou, L.
author2_role author
author
author
author
author
author
dc.contributor.none.fl_str_mv Universidade do Minho
dc.contributor.author.fl_str_mv Silva, Ângelo D. M.
Silva, Mariana M.
Figueiredo, Hugo
Delgado, Isabel
Lopes, Paulo E.
Paiva, Maria C.
Hilliou, L.
dc.subject.por.fl_str_mv Solder paste
Electrically conductive adhesives
Carbon nanotubes
Exfoliated graphite
Stencil printing
Yield stress
Printed circuit boards
Rheology
Engenharia e Tecnologia::Engenharia dos Materiais
Science & Technology
topic Solder paste
Electrically conductive adhesives
Carbon nanotubes
Exfoliated graphite
Stencil printing
Yield stress
Printed circuit boards
Rheology
Engenharia e Tecnologia::Engenharia dos Materiais
Science & Technology
description Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB.
publishDate 2021
dc.date.none.fl_str_mv 2021-12-15
2021-12-15T00:00:00Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv https://hdl.handle.net/1822/77279
url https://hdl.handle.net/1822/77279
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv 10.3390/ma14247734
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv MDPI
publisher.none.fl_str_mv MDPI
dc.source.none.fl_str_mv reponame:Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
instname:FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia
instacron:RCAAP
instname_str FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia
instacron_str RCAAP
institution RCAAP
reponame_str Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
collection Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)
repository.name.fl_str_mv Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) - FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia
repository.mail.fl_str_mv info@rcaap.pt
_version_ 1833594832658890752

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