Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells
Main Author: | |
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Publication Date: | 2022 |
Other Authors: | , |
Language: | eng |
Source: | Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) |
Download full: | https://hdl.handle.net/1822/89644 |
Summary: | The Atomic Layer Deposition (ALD) technique can be used to increase the lifetime of microfabricated rubidium vapor cells (magnetic sensors for magnetoencephalography) by an ultra-thin coating layer deposited on the internal cell walls (Figure 1). The ALD presents excellent control over the ultra thin films thickness (< 20 nm) and allows complex 3D structures to be covered with a high-aspect-ratio coating. This work shows the characterization of alumina (Al2O3) and silicon dioxide (SiO2) ultra-thin films deposited by Thermal ALD (ThALD) and Plasma-Enhanced ALD (PEALD). |
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Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cellsAtomic Layer DepositionALDAl2O3SiO2Thin-filmsEngenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e InformáticaThe Atomic Layer Deposition (ALD) technique can be used to increase the lifetime of microfabricated rubidium vapor cells (magnetic sensors for magnetoencephalography) by an ultra-thin coating layer deposited on the internal cell walls (Figure 1). The ALD presents excellent control over the ultra thin films thickness (< 20 nm) and allows complex 3D structures to be covered with a high-aspect-ratio coating. This work shows the characterization of alumina (Al2O3) and silicon dioxide (SiO2) ultra-thin films deposited by Thermal ALD (ThALD) and Plasma-Enhanced ALD (PEALD).This work was supported by: project MME and FCT with the project MPhotonBiopsy, PTDC/FIS-OTI/1259/2020, Infrastructures Micro&NanoFabs@PT, reference NORTE-01-0145-FEDER-022090, POR Norte, Portugal 2020.Universidade do MinhoCunha, Florival MouraSilva, Manuel Fernando RibeiroCorreia, J. H.2022-09-072022-09-07T00:00:00Zconference posterinfo:eu-repo/semantics/publishedVersionapplication/pdfhttps://hdl.handle.net/1822/89644enginfo:eu-repo/semantics/openAccessreponame:Repositórios Científicos de Acesso Aberto de Portugal (RCAAP)instname:FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologiainstacron:RCAAP2024-05-11T06:16:34Zoai:repositorium.sdum.uminho.pt:1822/89644Portal AgregadorONGhttps://www.rcaap.pt/oai/openaireinfo@rcaap.ptopendoar:https://opendoar.ac.uk/repository/71602025-05-28T15:47:22.407132Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) - FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologiafalse |
dc.title.none.fl_str_mv |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells |
title |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells |
spellingShingle |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells Cunha, Florival Moura Atomic Layer Deposition ALD Al2O3 SiO2 Thin-films Engenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e Informática |
title_short |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells |
title_full |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells |
title_fullStr |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells |
title_full_unstemmed |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells |
title_sort |
Characterization of Al2O3 and SiO2 ultra thin-films deposited by ALD for microfabricated rubidium vapor cells |
author |
Cunha, Florival Moura |
author_facet |
Cunha, Florival Moura Silva, Manuel Fernando Ribeiro Correia, J. H. |
author_role |
author |
author2 |
Silva, Manuel Fernando Ribeiro Correia, J. H. |
author2_role |
author author |
dc.contributor.none.fl_str_mv |
Universidade do Minho |
dc.contributor.author.fl_str_mv |
Cunha, Florival Moura Silva, Manuel Fernando Ribeiro Correia, J. H. |
dc.subject.por.fl_str_mv |
Atomic Layer Deposition ALD Al2O3 SiO2 Thin-films Engenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e Informática |
topic |
Atomic Layer Deposition ALD Al2O3 SiO2 Thin-films Engenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e Informática |
description |
The Atomic Layer Deposition (ALD) technique can be used to increase the lifetime of microfabricated rubidium vapor cells (magnetic sensors for magnetoencephalography) by an ultra-thin coating layer deposited on the internal cell walls (Figure 1). The ALD presents excellent control over the ultra thin films thickness (< 20 nm) and allows complex 3D structures to be covered with a high-aspect-ratio coating. This work shows the characterization of alumina (Al2O3) and silicon dioxide (SiO2) ultra-thin films deposited by Thermal ALD (ThALD) and Plasma-Enhanced ALD (PEALD). |
publishDate |
2022 |
dc.date.none.fl_str_mv |
2022-09-07 2022-09-07T00:00:00Z |
dc.type.driver.fl_str_mv |
conference poster |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
https://hdl.handle.net/1822/89644 |
url |
https://hdl.handle.net/1822/89644 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
application/pdf |
dc.source.none.fl_str_mv |
reponame:Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) instname:FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia instacron:RCAAP |
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RCAAP |
reponame_str |
Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) |
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Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) |
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Repositórios Científicos de Acesso Aberto de Portugal (RCAAP) - FCCN, serviços digitais da FCT – Fundação para a Ciência e a Tecnologia |
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