Distribuição das tensões geradas em implantes interconectados com barra dolder, após solda a laser

• Ano de defesa: 2007
• Autor(a) principal: Araújo Filho, Glécio Clemente de
• Tipo de documento: Dissertação
• Tipo de acesso: Acesso aberto
• Idioma: por
• Instituição de defesa: Universidade Federal de Uberlândia; BR; Programa de Pós-graduação em Odontologia; Ciências da Saúde; UFU
• Palavras-chave em Português: Soldagem; Adaptação; Tensão; Fotoelasticidade; Implantes dentários; Implants; Soldering; Adaptation; Stress; Photoelasticity; CNPQ::CIENCIAS DA SAUDE::ODONTOLOGIA
• Link de acesso: https://repositorio.ufu.br/handle/123456789/17046

The Implant-retained prostheses need passivity and justness in their settlement, which are considered prerequisites for the osseointegration success. To minimize distortions and to promote passive settlement it is used the cut and solder of the piece. This work investigated, through photoelasticity, the distribution of stress generated by implants interconnected with a laser welded, sectioned, molten and metallic bar. Six photoelastics models, which contain the implant groups/pillars/indexed and cut bars, were obtained from silicone molds avoiding supposed stress proceeded from dimensional alterations caused by the acrylic resin polymerization process, which is utilized bars indexation. Stress absence was observed In the models, on a polariscopic. Afterwarsds, the bars were soldered by laser in the laboratory and repositioned into the photoelastics models; twenty-five points, in the body of implants and inter-implant region, were evaluated under two conditions: after torque of 20 Ncm and under loading of 2 KgF. In the first condition, the maximum shear tension gradients were practically null in all evaluated points, the developed patterns of fringes- in all the models (1 to 6) - were uniform, suggesting symmetry among the system components during the adaptation process and some possible positive influence caused by the laser soldering process on the level of generated stress; it - the process has been characterized as a technical-sensitive procedure. The uniform distribution of stress patterns was observed with the application of external loading because of stress absence after the laser soldering process.