Avaliação e aplicabilidade de arame ultrafino em Manufatura Aditiva por Deposição a Arco (MADA)
Ano de defesa: | 2020 |
---|---|
Autor(a) principal: | |
Orientador(a): | |
Banca de defesa: | |
Tipo de documento: | Dissertação |
Tipo de acesso: | Acesso aberto |
Idioma: | por |
Instituição de defesa: |
Universidade Federal de Uberlândia
Brasil Programa de Pós-graduação em Engenharia Mecânica |
Programa de Pós-Graduação: |
Não Informado pela instituição
|
Departamento: |
Não Informado pela instituição
|
País: |
Não Informado pela instituição
|
Palavras-chave em Português: | |
Link de acesso: | https://repositorio.ufu.br/handle/123456789/29303 http://doi.org/10.14393/ufu.di.2020.279 |
Resumo: | Arc-deposition Additive Manufacturing is especially important for the manufacture of carbon steel parts. Additionally, electric-arc processes provide good deposition rate. On the other hand, Laser processing delivers better dimensional resolution. Thus, while the Laser process using powder is more expensive, it provides a better-quality final surface and dimensional tolerance. Still with regard to Laser processing, there is the possibility of using wires, which would be a competitor against the use of arc processing, but the laser has lower deposition rate. Thus, a question arises: what would be the best possible resolution to be achieved by arc processes? Thus, in this work was used ultra-thin wire of 0.6 mm diameter carbon steel depositing material by Arc-deposition Additive Manufacturing. The objective is to demonstrate that the ultrafine wire arc process could reach resolutions close to those obtained by laser processing. From the parametric study of the 0.6 mm wire, it was possible to deposit parts with small thickness, but it was not possible to obtain resolutions of the order of millimeters. The main limiting factor was the humping effect added to the use of conventional welding equipment, which limits the process in terms of wire feedability. The 0.9 mm wire showed better results than the 0.6 mm one, both in terms of resolution and deposition efficiency. |